Solder Paste

SOLDER PASTE
Chemical Composition (wt. %) 
Sn63Pb37 
63±0.5 
Residue Content
Specification
Appearance
Adhesive paste in grayish black 
Weight 
500g/bottle, 10kg/box 
Melting Point, 
183 
Spec. Gravity, g/cm3 
8.60 
Tensile Strength, MPa 
51.3
1. With superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.
2.There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
3.The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
4.Beyond that, our Sn63Pb37 mid temperature tin lead solder paste for PCB can give favorable wetting property on the substrate made from different materials.
5. Owing to its wonderful soldering performance, this product will not produce any tiny solder bead after the soldering process is completed
1. With superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.
2.There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
3.The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
4.Beyond that, our Sn63Pb37 mid temperature tin lead solder paste for PCB can give favorable wetting property on the substrate made from different materials.
5. Owing to its wonderful soldering performance, this product will not produce any tiny solder bead after the soldering process is completed.